Die Flipper

Product Overview
Upon heating and exerting pressure, conduct a PICK & PLACE process from the old bonding tape to another.

Product View
Product Feature
Specification
Misc

Die Flipper
Product Feature	Upon heating and exerting pressure, conduct a ¡§pick & place inch process from the old bonding tape to another
Application	Desktop-size / station-size; single cylinder / dual cylinder
Specialty	Build-to-order also available

(ps.different model)

Die Flipper
TYPE: W001AB Die Flipper
Dimension	As actual size
Weight	50-90 kg
Power	AC 110/220 5A
Pressure	3-5 kg/cm2
Temperature Control	PIDPID Temperature Control System
Timer	ANLY ASY-3SM
Air Valve	50X150WA25
Max Temperature	MAX 100 °C

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Die Flipper

Copyright © 2008 Swift Rich Technology
Address :4F., No.101, Sec. 3, Nanjing East Road., Jhongshan District, Taipei City, Taiwan (R.O.C.)
Phone : +886-2-82572175 Fax : : +886-2-82573663 Mobile : +886-0915-072-563
24Hr Service Hotline: +886-915-072-563

SRT specializes in multi-spin coater, wafer-related manufacturing equipments such as spin cleaner, spin dryer, die flipper, wafer expander, and wafer mounter